US 12,020,915B1
الصحة - Health
2024
مكتب البراءات الأمريكي - US Patent Office
Enshasy; Hesham Mohammed (ALHasaa, SA)
An etch process performed during semiconductor processing is monitored using a resonant structure on a surface of a wafer, formed on the surface of a wafer as a resonant cavity. A resonance sensor is positioned over the wafer within a plasma etch chamber so as to establish a resonance with the resonant structure. A resonant frequency of the resonant structure is sensed through the resonant structure and shifts in the resonant frequency are thereby detected during an etch process as a measurement of the etch process. The etch process is controlled in accordance with the shift in the resonant frequency.